Our porous ceramic and metal chuck table is a specially designed tool for water absorption and holding purposed during the production of semiconductor wafers. It is mainly used in back grinding and dicing processes. The back grinding chuck tables and dicing chuck tables work well with Japanese, German and Chinese dicing saws and back grinding machines, thus ensuring an excellent cost effectiveness.
1. This wafer chuck provides a high flatness and depth of parallelism.
2. It is compact in structure, uniform size and high strength.
3. It features a well-distributed absorption capacity.
4. The dicing accessory is easy to dress.
2, 3, 4, 5, 6, 8 and 12 inch semiconductor wafers
Back grinding machines, dicing saws